The wire diameter of Lead-free solder wire is 0.6mm, and the weight of a roll is 500g. The tin content is 99.3%, and the amount of flux is 2%. The solder wire has good activity, low melting point, and fast welding speed, which can reduce the impact on components during the welding process and has high insulation resistance. Good wettability and expansion ability make solder joints smooth, efficiently removing oxide film and protecting the brightness of solder joints.

Product parameters:

Wire diameter: 0.6mm

Application: circuit board welding

Working temperature: 300-350°C

Melting point: 183-245°C

Solder content: 99.3%

Flux content: 2%

Weight: 500g