Desoldering wire cores to remove dross Professional solder BGA repair tools are mainly used to quickly absorb excess tin solder. After removing the chip during desoldering, there is a lot of solder on the circuit board, which will affect the soldering of the chip. When soldering components such as ICs, place a de-tinning wire on the pins, which can suck out the tin sticking to the pins to ensure that there is no short circuit between the pins. In addition, when tin is planted on BGA components, solder wire can be used to clean the pads of BGA components, which can improve the success rate of ball planting. The no-cleaning tin absorption tape is made of pure copper and special chemicals. It is made of precise geometric shape, fast heat conduction and tin absorption, good tin absorption performance, oxidation resistance and corrosion resistance, and reduces the damage of electric iron. Suitable for all kinds of electronics, electrical appliances, and precision instruments, such as ASIC miners, mobile phones, laptops, welding tools, programming tools, BGA templates, power supplies, managers, microscopes, lamps, multimeters, heating stations, etc.

Specification:

Material: pure copper wire

Flux content: 2.0%

Melting point: 280℃

Length: 1.5 meters

Working temperature: 280-480℃

Sizes: 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm

Uses: Auxiliary circuit board soldering, desoldering.